SMT Assembly
Match solder paste selection to stencil printing, placement and reflow.
Match solder paste selection to stencil printing, placement and reflow.
Evaluate materials against the substrate, soldering temperature window and thermal design.
Consider assembly density, component heat sensitivity and rework needs.
Consider soldering processes for compact boards and connectors.
Match materials to mixed surface-mount and through-hole assembly.
Select materials with assembly method, operating environment and cleaning requirements in mind.
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